Technology | VLSI | CMOS | GaN | EDA Tools

Core Technologies

Technology Expertise

Comprehensive capabilities across the semiconductor design spectrum.

VLSI Design & IPs

Full-flow RTL to Tape-out using Synopsys (Fusion Compiler), Cadence (Virtuoso, Innovus), and Mentor (Calibre) tool stacks. Custom PDK libraries for 28nm, 14nm, 7nm, and 5nm nodes.

• RISC-V Processor Cores
• DDR5 PHY & PCIe Gen5
• USB4 & MIPI CSI/DSI
• Formal verification & logic synthesis
• Hardware security validation

FinFET & GAA CMOS

3D transistor architectures providing 30–50% lower power vs planar CMOS. Sub-threshold voltage scaling for mobile and AI chips.

• Tri-gate 3D current control
• Gate-All-Around (GAA) nanosheet
• SiGe strained channel mobility
• High-k metal gate (HKMG) dielectric
• Cleanroom Class 1-100 operations

GaN-on-Si Power

Wide-bandgap Gallium Nitride devices with 3× higher breakdown voltage and 5× lower on-resistance than legacy silicon.

• Power GaN HEMTs for EV Chargers
• RF Amplifiers for Defence Radar & mmWave
• 200mm wafer GaN-on-Si processing
• vertical MOCVD epitaxy lines
• GaN LED vertical integration

Innovation

R&D-Driven Innovation

Innovation is at the core of everything we do. Our R&D initiatives focus on pushing the boundaries of semiconductor technology to create next-generation solutions.

Emerging Technologies

Exploring AI accelerators, edge computing, and advanced packaging

Sustainable Design

Focus on low-power, energy-efficient semiconductor solutions

Academic Collaboration

Partnerships with universities for cutting-edge research

IP Development

Building reusable IP blocks for accelerated development

Roadmap

Technology Node Roadmap (2025–2037)

Phased rollout scaling from mature nodes to advanced sub-5nm GAA technologies.

Phase	Process Nodes	Technology Mandate	Target Applications	Timeline
Phase I	65nm / 28nm	Bulk CMOS, Planar FET	MCUs, IoT, Power Mgmt, Defence	Years 1–3
Phase II	14nm / 10nm	FinFET (Tri-gate)	Networking, EV, Healthcare ICs	Years 4–6
Phase III	7nm	Advanced FinFET + EUV	AI Edge SoCs, 5G, CCTV Vision	Years 7–9
Phase IV	5nm & Below	GAA Nanosheet FET	AI Superchips, Space, Quantum	Years 10+

Processes

Cutting-Edge Fab Processes Deployed

Our advanced campus incorporates the world's most sophisticated process machinery.

EUV & DUV Lithography

Extreme Ultraviolet (13.5nm wavelength) for sub-7nm patterning and dual-patterning Deep Ultraviolet (DUV) for 14nm/10nm nodes.

GaN-on-Si MOCVD

Metal-Organic Chemical Vapor Deposition lines for 200mm wafers, enabling power GaN HEMTs with 10x better merit than silicon.

GAA Nanosheet FET

Gate-All-Around transistor architecture where gate surrounds the channel on all 4 sides, enabling 3nm/5nm scaling.

Atomic Layer Deposition (ALD)

Angstrom-level precision dielectric and metal film deposition, critical for High-k gate dielectric (HfO₂) layers.

CMP & Planarization

Sub-nanometer surface planarization targeting 0.2nm surface roughness to match world-class foundry yields.

Heterogeneous Packaging

3D chip stacking utilizing Through-Silicon Via (TSV) technology for High Bandwidth Memory (HBM) and chiplet architectures.

Master Plan

Campus Master Plan & Land Segregation (14 Zones)

The Vayuvyastra campus is a self-sustaining industrial township spanning 4,000 acres, structured to segregate production, utilities, and human capital zones.

S.N.	Zone Name	Area (Acres)	Share (%)	Key Facilities & Specifications	Phase
1	Semiconductor Fab Core	950	23.8%	4 advanced Fab buildings, Cleanroom Class 1–10 environments, Metrology tools, Yield management core	Ph I–IV
2	Healthcare Electronics Unit	280	7.0%	MEMS & Biosensor fab, ISO 13485 compliant cleanrooms, clinical device testing laboratory	Phase I
3	LED Manufacturing Unit	210	5.3%	MOCVD epitaxy facility, high-speed die bonding, automated smart LED module assembly lines	Phase II
4	CCTV & Vision Security Unit	210	5.3%	SoC design studio, chip sorting & test, camera module assembly & hardware encryption validation	Phase II
5	R&D & Innovation Hub	320	8.0%	Licensed EDA computer labs, multi-project wafer (MPW) pilot lines, IP filing centre, university co-labs	Ph I–II
6	Administration & Operations	250	6.3%	HQ Tower, ERP/IT mainframe infrastructure, HR operations, legal counsel and security command center	Phase I
7	Employee Township & Housing	480	12.0%	Category A/B/C residential quarters, executive guest houses, community centers, daycares and schools	Phase II
8	Hospital & Wellness Centre	150	3.8%	150-bed multi-specialty hospital, outpatient clinics, cleanroom-aligned emergency ambulance hub	Phase I
9	Canteen & Food Court Zone	60	1.5%	Central industrial canteen (5,000-seat capability), local food streets, executive dining blocks	Phase I
10	Bank & Commercial Zone	40	1.0%	Domestic bank branches, round-the-clock ATM kiosk lobby, post office, and retail grocery stores	Phase II
11	Parking & Transport Hub	200	5.0%	Multi-level smart parking, EV fast-charging stations, shuttle bus terminal, logistics docking bays	Phase I
12	Green Belt & Recreational	400	10.0%	Contiguous forested buffer zones, landscaping parks, outdoor sports complex, indoor meditation hall	Phase II
13	Utilities Infrastructure Zone	100	2.5%	400kV main substation, 30,000 KL/day UPW purification plant, central STP/ETP, battery storage yard	Phase I
14	Expansion & Future Buffer	350	8.8%	Reserved space for Phase V GAA sub-2nm roadmap expansion and upstream chemical supplier units	Post Ph IV
-	TOTAL CAMPUS	4,000	100%	Self-sustaining deep-tech micro-city and manufacturing ecosystem	-

Infrastructure

Industrial Resource & Utility Infrastructure

High-precision semiconductor fabs require absolute resource security. Our infrastructure plans guarantee uninterrupted process supplies.

Daily Water Demand Breakdown

Facility / Unit	Water Quality	Demand (KL/day)	Source/Treatment
Semiconductor Fab	Ultra-Pure Water	12,000	5-stage RO-EDI-UV-Membrane UPW plant
Cooling & HVAC	Treated Industrial	8,000	Municipal feed + deep wells
Chemical Scrubbers	Process Grade	2,000	De-mineralized (DM) water plant
Assembly Units (3)	Treated Industrial	3,500	On-site effluent recycling plant
Township & Amenities	Potable Water	4,500	Municipal potable lines + STP reuse
PEAK WATER DEMAND	Mixed Grade	30,000	ZLD Compliant ETP (Zero Discharge)

UPW Water standard: Resistivity > 18 MΩ·cm at 25°C is maintained with zero particulate counts above 0.05 microns.

Electrical Load Allocation

Facility / Load Core	Load (MVA)	Peak (MW)	Uninterrupted Backup System
Semiconductor Fabs	450	380	Dual-feed 400kV substation + backup battery
Cleanroom HVAC / HEPA	120	95	Dedicated rotary UPS + dual DG farms
Assembly & Test Fabs	80	60	National Grid connection + DG backup
R&D, Admin & IT Server	40	30	Multi-tier UPS battery bank + Solar Park
Township & Amenities	30	22	Rooftop solar solar-grid feed + DG backup
TOTAL CONNECTED LOAD	720	~587	Dedicated substation + 30MW solar storage

Green energy mix: 30 MW solar park on campus covers 25% of load by Year 5, scaling to 50% by Year 10.

Site Selection & Logistics Criteria

To operate a high-volume wafer fab, contiguous land configurations and infrastructure are required. Vayuvyastra has earmarked locations that satisfy government PLI logistics requirements:

Telangana
Fab City SEZ, Hyderabad

Andhra Pradesh
APSEZ Industrial Corridor

Gujarat
GIFT City / DMIC Corridor

Maharashtra
Pune-Nashik MIDC

Proximity to an international airport (< 50 km) is mandatory for raw silicon wafer imports and export shipping logistics.

Financials

Financial Phasing, Costs & DEBITA Analysis

A ₹1,90,000 Crore megaproject requires meticulous financial forecasting and structured phasing to guarantee return on equity.

Phase-wise CAPEX Phasing

Phase	Timeline	Core Capital Activities	CAPEX (₹ Cr)	Share
Phase I	Years 1-3	65nm/28nm Fab core, Healthcare MEMS Fab, site preparation, civil works	45,000	23.7%
Phase II	Years 4-6	14nm/10nm FinFET lines, GaN power lines, LED & CCTV assembly factories	65,000	34.2%
Phase III	Years 7-9	7nm advanced EUV fab lines, wafer scaling, product IP expansions	50,000	26.3%
Phase IV	Years 10-12	5nm GAA advanced fab lines, R&D park, global export and commercial township	30,000	15.8%

CAPEX Allocation by Category

Cost Head Category	Key Sub-category Items	Budget (₹ Cr)	Share
Fab Equipment & Tools	ASML EUV/DUV Lithography, CVD, CMP, Metrology	72,000	37.9%
Civil & Infrastructure	Buildings, cleanroom HVAC (Class 1-100), gas yards	28,500	15.0%
Downstream Units	Healthcare MEMS, LED assembly, CCTV vision units	57,000	30.0%
Land & Site Dev	4,000 acres, site levelling, roads, drainage utilities	12,000	6.3%
R&D & Innovation	EDA Tool Licenses, multi-project wafer pilot lines	12,000	6.3%
Working Capital & Ops	Chemicals, process gases, test wafers, initial staff ramp	8,500	4.5%

Project Funding & Capital Structure

Funding Source Group	Amount (₹ Crores)	Share (%)	Financial Instrument	Strategic Rationale & Milestones
Government of India (MeitY)	57,000	30.0%	Capital Subsidy Grant	Bilateral approvals under India's Semiconductor Mission (ISMC Scheme)
State Government Partner	19,000	10.0%	Land Equity + Grants	Freehold land transfer + capex PLI rebates and power tariff subsidies
Strategic Foreign Investors	47,500	25.0%	Foreign Direct Investment	FDI Equity from US, EU, and Japanese fab equipment & material consortiums
Domestic Institutional Investors	28,500	15.0%	Equity + NCDs	Pension fund investments & Non-Convertible Debentures from DFIs
Long-term Project Debt	38,000	20.0%	Consortium Term Loan	Bank consortium loan at 7.5% interest, with a 3-year grace moratorium
TOTAL FUNDING CAPITAL	1,90,000	100%	Mixed Structure	Earmarked to support all phases from greenfield setup to advanced fabs

15-Year Financial Forecast & DEBITA Analysis (₹ Crores)

Year	Revenue	OPEX	CAPEX	EBITDA	Interest	Depreciation	PBT	Tax (25%)	PAT
Year 1	0	2,000	15,000	(2,000)	2,850	1,500	(6,350)	—	(6,350)
Year 2	500	3,500	18,000	(3,000)	4,500	3,200	(10,700)	—	(10,700)
Year 3	2,500	5,000	12,000	(2,500)	5,100	4,800	(12,400)	—	(12,400)
Year 4	8,000	7,000	20,000	1,000	4,800	6,500	(10,300)	—	(10,300)
Year 5	18,000	9,500	22,000	8,500	4,200	8,100	(3,800)	—	(3,800)
Year 6	32,000	12,000	23,000	20,000	3,800	9,500	6,700	1,675	5,025
Year 7	55,000	15,000	18,000	40,000	3,200	10,200	26,600	6,650	19,950
Year 8	80,000	18,000	14,000	62,000	2,600	10,800	48,600	12,150	36,450
Year 9	1,05,000	20,000	10,000	85,000	2,000	11,200	71,800	17,950	53,850
Year 10	1,30,000	22,000	8,000	1,08,000	1,400	11,500	95,100	23,775	71,325
Year 12	1,75,000	25,000	5,000	1,50,000	800	11,500	1,37,700	34,425	1,03,275
Year 15	2,35,000	28,000	2,000	2,07,000	200	10,500	1,96,300	49,075	1,47,225

Debt Service & Amortisation Schedule

Repayment Period	Outstanding Debt	Annual Principal Repayment	Interest Payments (7.5%)	Debt-Service Coverage Ratio
Years 1–3 (Grace Period)	₹38,000 Cr	NIL (Moratorium)	₹2,850 Cr/yr (Capitalized)	N/A
Years 4–6	₹38,000 Cr → ₹28,000 Cr	₹3,333 Cr/yr	₹3,900 Cr → ₹2,100 Cr	0.9× → 1.8×
Years 7–10	₹28,000 Cr → ₹5,000 Cr	₹5,750 Cr/yr	₹2,100 Cr → ₹375 Cr	3.2× → 8.5×
Years 11+ (Debt FREE)	Fully Repaid	NIL	NIL	Cash Rich

PLI & Government Incentive Impact

Incentive Program / Scheme	Detailed Provisions & Strategic Allocation	Projected Financial Impact
MeitY ISMC Scheme	50% of total project cost eligible for capital subsidy grants for greenfield fab.	₹42,500 Cr (Grant over 6 years)
State Government PLI (TS/AP model)	20% capital expenditure reimbursement on tools, cleanroom build, and land subsidies.	₹14,400 Cr (Equipment Subsidy)
SEZ / IFSC Corporate Income Tax Holiday	100% corporate tax exemption for the first 10 years of profitable operations.	0% Corporate Tax (Years 6–10)
Industrial Power Tariff Rebate	₹2 per unit industrial power tariff rebate for high-load cleanroom HVAC operations.	~₹900 Cr / year (At full scale)
MSME / Startup India GST Refund	Full refund on domestic and imported capital equipment procurement and duties.	₹4,500 Cr (Capital GST Refund)
TOTAL CUMULATIVE INCENTIVES	Combined central & state policy incentive package over 10 years.	~₹62,300 Crores

DEBITA Projections Key Highlights

Break-even Milestone: EBITDA break-even and PAT break-even are achieved in Year 6 after resolving deferred cap losses.
Debt Service: The project consortium debt of ₹38,000 Crore features a 3-year moratorium. Repayment runs at ₹3,333 Cr/yr from Year 4, scaling to ₹5,750 Cr/yr from Year 7, achieving full debt-free status by Year 11.
Special Incentives: Total government policy support under SEZ/ISM stands at ₹62,300 Crores over 10 years, including 50% capital subsidies, PLI reimbursements, and state power subsidies (₹2/unit).

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